MM74HC02M
vs
74HC02D,652
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
NXP SEMICONDUCTORS
Package Description
PLASTIC, SO-14
3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14
Reach Compliance Code
compliant
compliant
Family
HC/UH
HC/UH
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
JESD-609 Code
e0
e4
Length
8.65 mm
8.65 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
NOR GATE
NOR GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP14,.25
SOP14,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Propagation Delay (tpd)
23 ns
27 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Seated Height-Max
1.75 mm
1.75 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
Tin/Lead (Sn/Pb)
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
3.9 mm
3.9 mm
Base Number Matches
5
2
Part Package Code
SOIC
Pin Count
14
Manufacturer Package Code
SOT108-1
ECCN Code
EAR99
HTS Code
8542.39.00.01
Factory Lead Time
4 Weeks
Max I(ol)
0.004 A
Moisture Sensitivity Level
1
Packing Method
BULK
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
27 ns
Time@Peak Reflow Temperature-Max (s)
30
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