74HC02D,652 vs TC74HC02AFN-ELP feature comparison

74HC02D,652 Nexperia

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TC74HC02AFN-ELP Toshiba America Electronic Components

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NEXPERIA TOSHIBA CORP
Part Package Code SOIC SOIC
Package Description SOP-14 SOP, SOP14,.25
Pin Count 14 14
Manufacturer Package Code SOT108-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Date Of Intro 1990-12-01
Samacsys Manufacturer Nexperia
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e4 e0
Length 8.65 mm 8.65 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NOR GATE NOR GATE
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 240
Propagation Delay (tpd) 27 ns 19 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm 3.9 mm
Base Number Matches 2 1
Pbfree Code No
Max I(ol) 0.004 A
Package Equivalence Code SOP14,.25
Packing Method TR
Prop. Delay@Nom-Sup 19 ns
Schmitt Trigger NO

Compare 74HC02D,652 with alternatives

Compare TC74HC02AFN-ELP with alternatives