MM54HC4514J
vs
MC74VHC259DTEL
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
ON SEMICONDUCTOR
Package Description
DIP, DIP24,.3
TSSOP,
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
ADDRESS LATCHES
ADDRESS LATCHES
Family
HC/UH
AHC/VHC
Input Conditioning
LATCHED
STANDARD
JESD-30 Code
R-GDIP-T24
R-PDSO-G16
JESD-609 Code
e0
Load Capacitance (CL)
50 pF
Logic IC Type
4-LINE TO 16-LINE DECODER
3-LINE TO 8-LINE DECODER
Max I(ol)
0.004 A
Number of Functions
1
1
Number of Terminals
24
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Polarity
TRUE
TRUE
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
TSSOP
Package Equivalence Code
DIP24,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Prop. Delay@Nom-Sup
263 ns
Propagation Delay (tpd)
263 ns
14.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.572 mm
1.2 mm
Supply Voltage-Max (Vsup)
6 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
4.5 V
3.3 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
4.4 mm
Base Number Matches
5
1
Part Package Code
TSSOP
Pin Count
16
Length
5 mm
Compare MM54HC4514J with alternatives
Compare MC74VHC259DTEL with alternatives