MM54HC157J
vs
MM54HC157J-MIL
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
NATIONAL SEMICONDUCTOR CORP
|
| Package Description |
DIP,
|
DIP, DIP16,.3
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
HC/UH
|
|
| JESD-30 Code |
R-GDIP-T16
|
R-XDIP-T16
|
| Length |
19.43 mm
|
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Number of Functions |
4
|
4
|
| Number of Inputs |
2
|
2
|
| Number of Outputs |
1
|
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Polarity |
TRUE
|
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Propagation Delay (tpd) |
37 ns
|
|
| Seated Height-Max |
5.08 mm
|
|
| Supply Voltage-Max (Vsup) |
6 V
|
|
| Supply Voltage-Min (Vsup) |
2 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
7.62 mm
|
|
| Base Number Matches |
3
|
2
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Package Equivalence Code |
|
DIP16,.3
|
| Qualification Status |
|
Not Qualified
|
| Screening Level |
|
MIL-STD-883 Class B (Modified)
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare MM54HC157J with alternatives
Compare MM54HC157J-MIL with alternatives