MM54HC157J vs MC74HC157ANG feature comparison

MM54HC157J Rochester Electronics LLC

Buy Now Datasheet

MC74HC157ANG onsemi

Buy Now Datasheet
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC ONSEMI
Package Description DIP, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, DIP-16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-GDIP-T16 R-PDIP-T16
Length 19.43 mm 19.175 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Polarity TRUE TRUE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Propagation Delay (tpd) 37 ns 160 ns
Seated Height-Max 5.08 mm 4.44 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 40
Width 7.62 mm 7.62 mm
Base Number Matches 3 2
Pbfree Code Yes
Rohs Code Yes
Part Package Code DIP
Pin Count 16
Factory Lead Time 4 Weeks
Samacsys Manufacturer onsemi
JESD-609 Code e3
Load Capacitance (CL) 50 pF
Max I(ol) 0.006 A
Output Characteristics 3-STATE
Package Equivalence Code DIP16,.3
Packing Method RAIL
Prop. Delay@Nom-Sup 32 ns
Qualification Status Not Qualified
Terminal Finish Tin (Sn)

Compare MM54HC157J with alternatives

Compare MC74HC157ANG with alternatives