MM54C200N
vs
MCM10144L
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
MOTOROLA INC
Package Description
DIP,
DIP, DIP16,.3
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
1200 ns
26 ns
JESD-30 Code
R-XDIP-T16
R-GDIP-T16
Length
19.305 mm
19.3 mm
Memory Density
256 bit
256 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
1
1
Number of Functions
1
1
Number of Terminals
16
16
Number of Words
256 words
256 words
Number of Words Code
256
256
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
75 °C
Operating Temperature-Min
-55 °C
Organization
256X1
256X1
Package Body Material
UNSPECIFIED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Seated Height-Max
5.08 mm
4.19 mm
Supply Voltage-Max (Vsup)
15 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
NO
Technology
CMOS
ECL
Temperature Grade
MILITARY
COMMERCIAL EXTENDED
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
1
1
Pbfree Code
Rohs Code
Part Package Code
DIP
Pin Count
16
JESD-609 Code
e0
Number of Ports
1
Output Characteristics
OPEN-EMITTER
Output Enable
NO
Package Equivalence Code
DIP16,.3
Qualification Status
Not Qualified
Supply Current-Max
0.13 mA
Terminal Finish
TIN LEAD
Compare MM54C200N with alternatives
Compare MCM10144L with alternatives