MM54C200J
vs
AM27LS01/BEX
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
ADVANCED MICRO DEVICES INC
Package Description
DIP, DIP16,.3
DIP,
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
1200 ns
55 ns
I/O Type
SEPARATE
JESD-30 Code
R-CDIP-T16
R-GDIP-T16
JESD-609 Code
e0
Length
19.43 mm
19.431 mm
Memory Density
256 bit
256 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
1
1
Number of Functions
1
1
Number of Ports
1
Number of Terminals
16
16
Number of Words
256 words
256 words
Number of Words Code
256
256
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
256X1
256X1
Output Characteristics
3-STATE
Output Enable
NO
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
5.08 mm
Supply Voltage-Max (Vsup)
15 V
5.5 V
Supply Voltage-Min (Vsup)
3 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
TTL
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
4
1
Part Package Code
DIP
Pin Count
16
kg CO2e/kg
12
Average Weight (mg)
1187.4
CO2e (mg)
14248.8
Category CO2 Kg
12
Compliance Temperature Grade
Military: -55C to +125C
Compare MM54C200J with alternatives
Compare AM27LS01/BEX with alternatives