MM3Z2V7ST3G
vs
BZX284-C10
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
ON SEMICONDUCTOR
NXP SEMICONDUCTORS
Package Description
0.067 X 0.049 INCH, 0.035 INCH HEIGHT, LEAD FREE, PLASTIC, CASE 477-02, 2 PIN
CERAMIC PACKAGE-2
Pin Count
2
2
Manufacturer Package Code
CASE 477-02
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
100 Ω
400 Ω
JESD-30 Code
R-PDSO-G2
R-CDSO-R2
JESD-609 Code
e3
e2
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
150 °C
150 °C
Operating Temperature-Min
-65 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.2 W
0.4 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
2.7 V
10 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
Tin (Sn)
Tin/Copper (Sn/Cu)
Terminal Form
GULL WING
WRAP AROUND
Terminal Position
DUAL
DUAL
Voltage Tol-Max
4.3%
5%
Working Test Current
5 mA
5 mA
Base Number Matches
1
3
Samacsys Manufacturer
NXP
Peak Reflow Temperature (Cel)
260
Compare MM3Z2V7ST3G with alternatives
Compare BZX284-C10 with alternatives