MM3Z10VST3G
vs
BZX284-C10
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
ON SEMICONDUCTOR
NXP SEMICONDUCTORS
Package Description
HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, CASE 477-02, 2 PIN
CERAMIC PACKAGE-2
Pin Count
2
2
Manufacturer Package Code
CASE 477-02
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
15 Ω
400 Ω
JESD-30 Code
R-PDSO-G2
R-CDSO-R2
JESD-609 Code
e3
e2
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
150 °C
150 °C
Operating Temperature-Min
-65 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.3 W
0.4 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
10 V
10 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
MATTE TIN
Tin/Copper (Sn/Cu)
Terminal Form
GULL WING
WRAP AROUND
Terminal Position
DUAL
DUAL
Voltage Tol-Max
2%
5%
Working Test Current
5 mA
5 mA
Base Number Matches
1
3
Samacsys Manufacturer
NXP
Peak Reflow Temperature (Cel)
260
Compare MM3Z10VST3G with alternatives
Compare BZX284-C10 with alternatives