MM3Z10VST1G
vs
BZX284-C10
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ONSEMI
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SOD-323 2 LEAD
|
|
| Package Description |
HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, CASE 477-02, 2 PIN
|
CERAMIC PACKAGE-2
|
| Pin Count |
2
|
2
|
| Manufacturer Package Code |
477-02
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Factory Lead Time |
2 Days
|
|
| Samacsys Manufacturer |
onsemi
|
NXP
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| Dynamic Impedance-Max |
15 Ω
|
400 Ω
|
| JESD-30 Code |
R-PDSO-G2
|
R-CDSO-R2
|
| JESD-609 Code |
e3
|
e2
|
| Moisture Sensitivity Level |
1
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-65 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
0.3 W
|
0.4 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reference Voltage-Nom |
10 V
|
10 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
ZENER
|
ZENER
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
Tin/Copper (Sn/Cu)
|
| Terminal Form |
GULL WING
|
WRAP AROUND
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Voltage Tol-Max |
2%
|
5%
|
| Working Test Current |
5 mA
|
5 mA
|
| Base Number Matches |
1
|
3
|
| Rohs Code |
|
Yes
|
|
|
|
Compare MM3Z10VST1G with alternatives
Compare BZX284-C10 with alternatives