ML9352 vs ML9352 feature comparison

ML9352 LAPIS Semiconductor Co Ltd

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ML9352 OKI Electric Industry Co Ltd

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer LAPIS SEMICONDUCTOR CO LTD OKI ELECTRIC INDUSTRY CO LTD
Part Package Code DIE DIE
Package Description DIE, DIE OR CHIP DIE,
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Data Input Mode SERIAL/PARALLEL SERIAL/PARALLEL
Display Mode DOT MATRIX DOT MATRIX
Interface IC Type EL DISPLAY DRIVER EL DISPLAY DRIVER
JESD-30 Code R-XUUC-N X-XUUC-N
Multiplexed Display Capability NO NO
Number of Functions 1 1
Number of Segments 161 161
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIE DIE
Package Equivalence Code DIE OR CHIP
Package Shape RECTANGULAR UNSPECIFIED
Package Style UNCASED CHIP UNCASED CHIP
Qualification Status Not Qualified Not Qualified
Supply Current-Max 3 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 2.7 V 2.7 V
Supply Voltage-Nom 3 V 3 V
Supply Voltage1-Max 30 V 30 V
Supply Voltage1-Min 18 V 18 V
Surface Mount YES YES
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form NO LEAD NO LEAD
Terminal Position UPPER UPPER
fmax-Min 1 MHz 1 MHz
Base Number Matches 1 1