ML5800SK-02
vs
UAA2067G
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
RF MICRO DEVICES INC
NXP SEMICONDUCTORS
Part Package Code
QFN
QFP
Package Description
HVQCCN,
LFQFP,
Pin Count
32
32
Reach Compliance Code
unknown
unknown
ECCN Code
5A991.G
HTS Code
8517.70.00.00
8542.39.00.01
JESD-30 Code
S-PQCC-N32
S-PQFP-G32
JESD-609 Code
e3
Length
5 mm
5 mm
Number of Functions
1
1
Number of Terminals
32
32
Operating Temperature-Max
60 °C
85 °C
Operating Temperature-Min
-10 °C
-30 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVQCCN
LFQFP
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
FLATPACK, LOW PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
1.6 mm
Supply Current-Max
90 mA
Supply Voltage-Nom
3.3 V
3.6 V
Surface Mount
YES
YES
Telecom IC Type
CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT
CORDLESS TELEPHONE SUPPORT CIRCUIT
Temperature Grade
COMMERCIAL
OTHER
Terminal Finish
MATTE TIN
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Width
5 mm
5 mm
Base Number Matches
1
4
Technology
BICMOS
Compare ML5800SK-02 with alternatives
Compare UAA2067G with alternatives