ML2724DH vs MSM6870-3VGS-VK feature comparison

ML2724DH RF Micro Devices Inc

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MSM6870-3VGS-VK OKI Electric Industry Co Ltd

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICRO LINEAR CORP OKI ELECTRIC INDUSTRY CO LTD
Part Package Code QFP SSOP
Package Description TQFP, SSOP,
Pin Count 32 32
Reach Compliance Code unknown unknown
ECCN Code 5A991.G
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PQFP-G32 R-PDSO-G32
Length 7 mm 16 mm
Number of Functions 1 1
Number of Terminals 32 32
Operating Temperature-Max 60 °C 70 °C
Operating Temperature-Min -10 °C -30 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TQFP SSOP
Package Shape SQUARE RECTANGULAR
Package Style FLATPACK, THIN PROFILE SMALL OUTLINE, SHRINK PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 2.5 mm
Supply Voltage-Nom 3.3 V 3.6 V
Surface Mount YES YES
Telecom IC Type CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT CORDLESS TELEPHONE SUPPORT CIRCUIT
Temperature Grade COMMERCIAL OTHER
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 1 mm
Terminal Position QUAD DUAL
Width 7 mm 7.9 mm
Base Number Matches 2 1
Supply Current-Max 13 mA

Compare ML2724DH with alternatives

Compare MSM6870-3VGS-VK with alternatives