ML13158-8P vs MSM6870-3GS-VK feature comparison

ML13158-8P Lansdale Semiconductor Inc

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MSM6870-3GS-VK OKI Electric Industry Co Ltd

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LANSDALE SEMICONDUCTOR INC OKI ELECTRIC INDUSTRY CO LTD
Part Package Code QFP SSOP
Package Description LQFP, SSOP,
Pin Count 32 32
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PQFP-G32 R-PDSO-G32
Length 7 mm 16 mm
Number of Functions 1 1
Number of Terminals 32 32
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C -30 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP SSOP
Package Shape SQUARE RECTANGULAR
Package Style FLATPACK, LOW PROFILE SMALL OUTLINE, SHRINK PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 2.5 mm
Supply Current-Max 9.5 mA 13 mA
Supply Voltage-Nom 3 V 3.6 V
Surface Mount YES YES
Technology BIPOLAR
Telecom IC Type CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT CORDLESS TELEPHONE SUPPORT CIRCUIT
Temperature Grade INDUSTRIAL OTHER
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 1 mm
Terminal Position QUAD DUAL
Width 7 mm 7.9 mm
Base Number Matches 1 1

Compare ML13158-8P with alternatives

Compare MSM6870-3GS-VK with alternatives