ML13158-8P
vs
MSM6870-3GS-VK
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
LANSDALE SEMICONDUCTOR INC
|
OKI ELECTRIC INDUSTRY CO LTD
|
Part Package Code |
QFP
|
SSOP
|
Package Description |
LQFP,
|
SSOP,
|
Pin Count |
32
|
32
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PQFP-G32
|
R-PDSO-G32
|
Length |
7 mm
|
16 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
32
|
32
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
-30 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LQFP
|
SSOP
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
FLATPACK, LOW PROFILE
|
SMALL OUTLINE, SHRINK PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.6 mm
|
2.5 mm
|
Supply Current-Max |
9.5 mA
|
13 mA
|
Supply Voltage-Nom |
3 V
|
3.6 V
|
Surface Mount |
YES
|
YES
|
Technology |
BIPOLAR
|
|
Telecom IC Type |
CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT
|
CORDLESS TELEPHONE SUPPORT CIRCUIT
|
Temperature Grade |
INDUSTRIAL
|
OTHER
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.8 mm
|
1 mm
|
Terminal Position |
QUAD
|
DUAL
|
Width |
7 mm
|
7.9 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare ML13158-8P with alternatives
Compare MSM6870-3GS-VK with alternatives