ML13158-8P vs ML2722DH-T feature comparison

ML13158-8P Lansdale Semiconductor Inc

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ML2722DH-T RF Micro Devices Inc

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer LANSDALE SEMICONDUCTOR INC MICRO LINEAR CORP
Part Package Code QFP QFP
Package Description LQFP, TQFP,
Pin Count 32 32
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8517.70.00.00
JESD-30 Code S-PQFP-G32 S-PQFP-G32
Length 7 mm 7 mm
Number of Functions 1 1
Number of Terminals 32 32
Operating Temperature-Max 85 °C 60 °C
Operating Temperature-Min -40 °C -10 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP TQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE FLATPACK, THIN PROFILE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.2 mm
Supply Current-Max 9.5 mA 63.5 mA
Supply Voltage-Nom 3 V 3.3 V
Surface Mount YES YES
Technology BIPOLAR BICMOS
Telecom IC Type CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position QUAD QUAD
Width 7 mm 7 mm
Base Number Matches 1 1
ECCN Code 5A991.G

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