MJF13007
vs
BUJ105AB,118
feature comparison
All Stats
Differences Only
Rohs Code
No
Yes
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MOTOROLA INC
NXP SEMICONDUCTORS
Package Description
FLANGE MOUNT, R-PSFM-T3
SMALL OUTLINE, R-PSSO-G2
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.29.00.95
8541.29.00.75
Case Connection
ISOLATED
COLLECTOR
Collector Current-Max (IC)
8 A
8 A
Collector-Emitter Voltage-Max
400 V
400 V
Configuration
SINGLE
SINGLE
DC Current Gain-Min (hFE)
5
13
JEDEC-95 Code
TO-220AB
JESD-30 Code
R-PSFM-T3
R-PSSO-G2
JESD-609 Code
e0
e3
Number of Elements
1
1
Number of Terminals
3
2
Operating Temperature-Max
150 °C
150 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLANGE MOUNT
SMALL OUTLINE
Polarity/Channel Type
NPN
NPN
Power Dissipation Ambient-Max
40 W
Power Dissipation-Max (Abs)
50 W
125 W
Qualification Status
Not Qualified
Not Qualified
Surface Mount
NO
YES
Terminal Finish
Tin/Lead (Sn/Pb)
TIN
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Position
SINGLE
SINGLE
Transistor Application
SWITCHING
SWITCHING
Transistor Element Material
SILICON
SILICON
Transition Frequency-Nom (fT)
14 MHz
Turn-off Time-Max (toff)
3700 ns
Turn-on Time-Max (ton)
1600 ns
VCEsat-Max
3 V
Base Number Matches
6
2
Part Package Code
D2PAK
Pin Count
3
Manufacturer Package Code
SOT404
Factory Lead Time
4 Weeks
Moisture Sensitivity Level
1
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