MIP7965-750B1R
vs
HD6417750SBP200
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
AEROFLEX PLAINVIEW
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
BGA,
|
BGA, BGA256,20X20,50
|
| Pin Count |
256
|
256
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
ALSO REQUIRES 2.5V OR 3.3V SUPPLY
|
|
| Address Bus Width |
|
26
|
| Bit Size |
64
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
133 MHz
|
34 MHz
|
| External Data Bus Width |
|
64
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
| Length |
27 mm
|
27 mm
|
| Low Power Mode |
NO
|
YES
|
| Number of Terminals |
256
|
256
|
| Operating Temperature-Max |
110 °C
|
75 °C
|
| Operating Temperature-Min |
-55 °C
|
-20 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Speed |
750 MHz
|
200 MHz
|
| Supply Voltage-Max |
1.35 V
|
2.07 V
|
| Supply Voltage-Min |
1.25 V
|
1.8 V
|
| Supply Voltage-Nom |
1.3 V
|
1.95 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
COMMERCIAL EXTENDED
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
27 mm
|
27 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
4
|
2
|
| Pbfree Code |
|
No
|
| Manufacturer Package Code |
|
PRBG0256DE
|
| Samacsys Manufacturer |
|
Renesas Electronics
|
| JESD-609 Code |
|
e0
|
| Package Equivalence Code |
|
BGA256,20X20,50
|
| Seated Height-Max |
|
2.1 mm
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare MIP7965-750B1R with alternatives
Compare HD6417750SBP200 with alternatives