HD6417750SBP200 vs MPC870CVR133 feature comparison

HD6417750SBP200 Renesas Electronics Corporation

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MPC870CVR133 Freescale Semiconductor

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Pbfree Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer RENESAS ELECTRONICS CORP FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description BGA, BGA256,20X20,50 LEAD FREE, PLASTIC, BGA-256
Pin Count 256 256
Manufacturer Package Code PRBG0256DE
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer Renesas Electronics NXP
Address Bus Width 26 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 34 MHz
External Data Bus Width 64 32
Format FLOATING POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0 e1
Length 27 mm 23 mm
Low Power Mode YES YES
Number of Terminals 256 256
Operating Temperature-Max 75 °C
Operating Temperature-Min -20 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA HBGA
Package Equivalence Code BGA256,20X20,50 BGA256,16X16,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, HEAT SINK/SLUG
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.1 mm 2.54 mm
Speed 200 MHz 133 MHz
Supply Voltage-Max 2.07 V 1.9 V
Supply Voltage-Min 1.8 V 1.7 V
Supply Voltage-Nom 1.95 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL EXTENDED
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 23 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 2
Rohs Code Yes
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30

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Compare MPC870CVR133 with alternatives