MIP7365-450B1M vs IBM25PPC750CX-CP50-3T feature comparison

MIP7365-450B1M Cobham PLC

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IBM25PPC750CX-CP50-3T IBM

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer COBHAM PLC IBM MICROELECTRONICS
Package Description BGA, BGA, BGA256,20X20,50
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32
Bit Size 64 32
Boundary Scan YES YES
Clock Frequency-Max 133 MHz 133 MHz
External Data Bus Width 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code R-PBGA-B256 S-PBGA-B256
Low Power Mode YES YES
Number of Terminals 256 256
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape RECTANGULAR SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Speed 450 MHz 500 MHz
Supply Voltage-Max 1.35 V 1.9 V
Supply Voltage-Min 1.25 V 1.7 V
Supply Voltage-Nom 1.3 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR, RISC
Base Number Matches 2 1
Rohs Code No
Part Package Code BGA
Pin Count 256
JESD-609 Code e0
Length 27 mm
Package Equivalence Code BGA256,20X20,50
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 1.27 mm
Width 27 mm

Compare MIP7365-450B1M with alternatives

Compare IBM25PPC750CX-CP50-3T with alternatives