IBM25PPC750CX-CP50-3T vs 79RC32T365180BC feature comparison

IBM25PPC750CX-CP50-3T IBM

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79RC32T365180BC Integrated Device Technology Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer IBM MICROELECTRONICS INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA BGA
Package Description BGA, BGA256,20X20,50 17 X 17 MM, MO-192, CABGA-256
Pin Count 256 256
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 133 MHz 90 MHz
External Data Bus Width 64 32
Format FLOATING POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0 e0
Length 27 mm 17 mm
Low Power Mode YES YES
Number of Terminals 256 256
Operating Temperature-Max 85 °C 70 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Equivalence Code BGA256,20X20,50 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Qualification Status Not Qualified Not Qualified
Speed 500 MHz 180 MHz
Supply Voltage-Max 1.9 V 2.625 V
Supply Voltage-Min 1.7 V 2.375 V
Supply Voltage-Nom 1.8 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 17 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Pbfree Code No
Moisture Sensitivity Level 3
Operating Temperature-Min
Peak Reflow Temperature (Cel) 225
Seated Height-Max 1.7 mm
Temperature Grade COMMERCIAL
Time@Peak Reflow Temperature-Max (s) 20

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