MIP7365-450B1M vs 79RC32V334-133BBI feature comparison

MIP7365-450B1M Cobham PLC

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79RC32V334-133BBI Integrated Device Technology Inc

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer COBHAM PLC INTEGRATED DEVICE TECHNOLOGY INC
Package Description BGA, 27 X 27 MM, PLASTIC, BGA-256
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Address Bus Width 32
Bit Size 64 32
Boundary Scan YES YES
Clock Frequency-Max 133 MHz 66.67 MHz
External Data Bus Width 32
Format FLOATING POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code R-PBGA-B256 S-PBGA-B256
Low Power Mode YES YES
Number of Terminals 256 256
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape RECTANGULAR SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Speed 450 MHz 133 MHz
Supply Voltage-Max 1.35 V 3.465 V
Supply Voltage-Min 1.25 V 3.135 V
Supply Voltage-Nom 1.3 V 3.3 V
Surface Mount YES YES
Technology CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR, RISC
Base Number Matches 2 1
Rohs Code No
Part Package Code BGA
Pin Count 256
JESD-609 Code e0
Length 17 mm
Moisture Sensitivity Level 3
Package Equivalence Code BGA256,16X16,40
Peak Reflow Temperature (Cel) 225
Power Supplies 3.3 V
Seated Height-Max 3.5 mm
Supply Current-Max 630 mA
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Pitch 1 mm
Time@Peak Reflow Temperature-Max (s) 20
Width 17 mm

Compare MIP7365-450B1M with alternatives

Compare 79RC32V334-133BBI with alternatives