MIMXRT1052CVL5B
vs
XAM3359ZCZD50
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
TEXAS INSTRUMENTS INC
Package Description
MABGA-196
LFBGA,
Reach Compliance Code
compliant
unknown
ECCN Code
5A992.C
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Factory Lead Time
13 Weeks
Samacsys Manufacturer
NXP
Additional Feature
24MHZ NOMINAL CRYSTAL FREQUENCY AVAILABLE
JESD-30 Code
S-PBGA-B196
S-PBGA-B324
JESD-609 Code
e1
e1
Length
10 mm
15 mm
Moisture Sensitivity Level
3
Number of Terminals
196
324
Operating Temperature-Max
105 °C
90 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Equivalence Code
BGA196,14X14,32
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
Seated Height-Max
1.52 mm
1.4 mm
Supply Voltage-Max
1.26 V
1.15 V
Supply Voltage-Min
1.15 V
1.06 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.65 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Width
10 mm
15 mm
uPs/uCs/Peripheral ICs Type
SoC
MICROPROCESSOR, RISC
Base Number Matches
1
1
Part Package Code
BGA
Pin Count
324
Address Bus Width
Bit Size
32
Boundary Scan
YES
Clock Frequency-Max
26 MHz
External Data Bus Width
Format
FIXED POINT
Integrated Cache
YES
Low Power Mode
YES
Speed
500 MHz
Supply Voltage-Nom
1.1 V
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