MIMXRT1052CVL5B
vs
XAM3358ZCED50
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
TEXAS INSTRUMENTS INC
|
Package Description |
MABGA-196
|
LFBGA,
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
5A992.C
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Factory Lead Time |
4 Weeks
|
|
Samacsys Manufacturer |
NXP
|
|
Additional Feature |
24MHZ NOMINAL CRYSTAL FREQUENCY AVAILABLE
|
|
JESD-30 Code |
S-PBGA-B196
|
S-PBGA-B298
|
JESD-609 Code |
e1
|
e1
|
Length |
10 mm
|
13 mm
|
Moisture Sensitivity Level |
3
|
|
Number of Terminals |
196
|
298
|
Operating Temperature-Max |
105 °C
|
90 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
LFBGA
|
Package Equivalence Code |
BGA196,14X14,32
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Seated Height-Max |
1.52 mm
|
1.3 mm
|
Supply Voltage-Max |
1.26 V
|
1.15 V
|
Supply Voltage-Min |
1.15 V
|
1.06 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
10 mm
|
13 mm
|
uPs/uCs/Peripheral ICs Type |
SoC
|
MICROPROCESSOR, RISC
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
BGA
|
Pin Count |
|
298
|
Address Bus Width |
|
|
Bit Size |
|
32
|
Boundary Scan |
|
YES
|
Clock Frequency-Max |
|
26 MHz
|
External Data Bus Width |
|
|
Format |
|
FIXED POINT
|
Integrated Cache |
|
YES
|
Low Power Mode |
|
YES
|
Speed |
|
500 MHz
|
Supply Voltage-Nom |
|
1.1 V
|
|
|
|
Compare MIMXRT1052CVL5B with alternatives
Compare XAM3358ZCED50 with alternatives