MIC58P42YWM
vs
MIC58P42YV
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
SOIC-18
|
PLCC-20
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
7 Weeks
|
|
Samacsys Manufacturer |
Microchip
|
|
Built-in Protections |
TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE
|
TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE
|
Driver Number of Bits |
8
|
|
Input Characteristics |
STANDARD
|
|
Interface IC Type |
SIPO BASED PERIPHERAL DRIVER
|
SIPO BASED PERIPHERAL DRIVER
|
JESD-30 Code |
R-PDSO-G18
|
S-XQCC-J20
|
JESD-609 Code |
e3
|
|
Length |
11.55 mm
|
8.94 mm
|
Moisture Sensitivity Level |
2
|
|
Number of Functions |
8
|
8
|
Number of Terminals |
18
|
20
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Current Flow Direction |
SINK
|
SINK
|
Output Peak Current Limit-Nom |
0.5 A
|
|
Output Polarity |
INVERTED
|
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
SOP
|
QCCJ
|
Package Equivalence Code |
SOP18,.40
|
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
SMALL OUTLINE
|
CHIP CARRIER
|
Peak Reflow Temperature (Cel) |
260
|
|
Seated Height-Max |
2.64 mm
|
4.57 mm
|
Supply Current-Max |
10 mA
|
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
GULL WING
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
7.52 mm
|
8.94 mm
|
Base Number Matches |
2
|
1
|
Supply Voltage-Min |
|
4 V
|
|
|
|
Compare MIC58P42YWM with alternatives
Compare MIC58P42YV with alternatives