MIC5841BN
vs
UCQ5841LW
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
ALLEGRO MICROSYSTEMS LLC
Part Package Code
DIP
SOIC
Package Description
DIP-18
SOIC-18
Pin Count
18
18
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Microchip
Built-in Protections
TRANSIENT
TRANSIENT
Driver Number of Bits
8
8
Interface IC Type
SIPO BASED PERIPHERAL DRIVER
SIPO BASED PERIPHERAL DRIVER
JESD-30 Code
R-PDIP-T18
R-PDSO-G18
JESD-609 Code
e0
e0
Number of Functions
1
1
Number of Terminals
18
18
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Current Flow Direction
SINK
SINK
Output Current-Max
0.35 A
0.35 A
Output Peak Current Limit-Nom
0.5 A
0.5 A
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP18,.3
SOP18,.4
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
240
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.937 mm
2.65 mm
Supply Voltage-Max
12 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
YES
Technology
BICMOS
BIMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
7.62 mm
7.5 mm
Base Number Matches
1
2
Rohs Code
kg CO2e/kg
12.04
Average Weight (mg)
546
CO2e (mg)
6573.84
Category CO2 Kg
12.04
Compliance Temperature Grade
Industrial: -40C to +85C
Length
11.55 mm
Compare MIC5841BN with alternatives
Compare UCQ5841LW with alternatives