MIC5801BWM-TR vs MIC5801YWM-TR feature comparison

MIC5801BWM-TR Microchip Technology Inc

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MIC5801YWM-TR Micrel Inc

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Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICREL INC
Package Description SOIC-24 LEAD FREE, SOIC-24
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01
Samacsys Manufacturer Microchip
Built-in Protections TRANSIENT TRANSIENT
Interface IC Type LATCH BASED PERIPHERAL DRIVER LATCH BASED PERIPHERAL DRIVER
JESD-30 Code R-PDSO-G24 R-PDSO-G24
Length 15.4 mm 15.4 mm
Number of Functions 8 8
Number of Terminals 24 24
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Current Flow Direction SINK SINK
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Seated Height-Max 2.65 mm 2.65 mm
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology BIMOS BIMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.5 mm 7.5 mm
Base Number Matches 1 2
JESD-609 Code e3
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Terminal Finish TIN
Time@Peak Reflow Temperature-Max (s) 40

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