MIC5801BN
vs
MIC5801BVT&R
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MICREL INC
|
MICREL INC
|
Part Package Code |
DIP
|
QLCC
|
Package Description |
DIP, DIP22,.4
|
QCCJ,
|
Pin Count |
22
|
28
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Microchip
|
|
Built-in Protections |
TRANSIENT
|
TRANSIENT
|
Driver Number of Bits |
8
|
|
Input Characteristics |
STANDARD
|
STANDARD
|
Interface IC Type |
LATCH BASED PERIPHERAL DRIVER
|
LATCH BASED PERIPHERAL DRIVER
|
JESD-30 Code |
R-PDIP-T22
|
S-PQCC-J28
|
JESD-609 Code |
e0
|
e0
|
Length |
27.559 mm
|
11.4554 mm
|
Number of Functions |
8
|
8
|
Number of Terminals |
22
|
28
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
OPEN-COLLECTOR
|
OPEN-COLLECTOR
|
Output Current Flow Direction |
SINK
|
SINK
|
Output Current-Max |
0.35 A
|
|
Output Peak Current Limit-Nom |
0.5 A
|
|
Output Polarity |
INVERTED
|
INVERTED
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
QCCJ
|
Package Equivalence Code |
DIP22,.4
|
LDCC28,.5SQ
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
IN-LINE
|
CHIP CARRIER
|
Peak Reflow Temperature (Cel) |
240
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
5.08 mm
|
4.318 mm
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
YES
|
Technology |
BIMOS
|
BIMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
THROUGH-HOLE
|
J BEND
|
Terminal Pitch |
2.54 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
10.16 mm
|
11.4554 mm
|
Base Number Matches |
1
|
2
|
Pbfree Code |
|
No
|
Moisture Sensitivity Level |
|
1
|
|
|
|
Compare MIC5801BN with alternatives
Compare MIC5801BVT&R with alternatives