MIC5801AJB
vs
UCS5801H883
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICREL INC
|
ALLEGRO MICROSYSTEMS LLC
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
DIP, DIP22,.4
|
DIP, DIP22,.4
|
| Pin Count |
22
|
22
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Built-in Protections |
TRANSIENT
|
TRANSIENT
|
| Driver Number of Bits |
8
|
8
|
| Input Characteristics |
STANDARD
|
|
| Interface IC Type |
LATCH BASED PERIPHERAL DRIVER
|
LATCH BASED PERIPHERAL DRIVER
|
| JESD-30 Code |
R-GDIP-T22
|
R-CDIP-T22
|
| JESD-609 Code |
e0
|
|
| Length |
27.178 mm
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
22
|
22
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Characteristics |
OPEN-COLLECTOR
|
|
| Output Current Flow Direction |
SINK
|
SOURCE
|
| Output Current-Max |
0.35 A
|
0.35 A
|
| Output Peak Current Limit-Nom |
0.5 A
|
0.5 A
|
| Output Polarity |
INVERTED
|
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP22,.4
|
DIP22,.4
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
5.08 mm
|
| Supply Current-Max |
2 mA
|
|
| Supply Voltage-Max |
12 V
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
BIMOS
|
BIMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
10.16 mm
|
10.16 mm
|
| Base Number Matches |
2
|
1
|
| Screening Level |
|
MIL-STD-883 Class B
|
|
|
|
Compare MIC5801AJB with alternatives
Compare UCS5801H883 with alternatives