MIC5209BM
vs
MIC5209YML-TR
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
MICREL INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
SOIC
|
|
Package Description |
SOP, SOP8,.25
|
|
Pin Count |
8
|
|
Reach Compliance Code |
not_compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Microchip
|
Microchip
|
Adjustability |
ADJUSTABLE
|
ADJUSTABLE
|
Dropout Voltage1-Max |
0.6 V
|
0.6 V
|
Dropout Voltage1-Nom |
0.35 V
|
0.35 V
|
JESD-30 Code |
R-PDSO-G8
|
S-PDSO-N8
|
JESD-609 Code |
e0
|
e4
|
Length |
4.93 mm
|
3 mm
|
Line Regulation-Max (%/V) |
0.1
|
0.0075
|
Load Regulation-Max(%) |
0.7%
|
0.7%
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Outputs |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature TJ-Max |
125 °C
|
125 °C
|
Operating Temperature TJ-Min |
-40 °C
|
-40 °C
|
Output Current1-Max |
0.5 A
|
0.5 A
|
Output Voltage1-Max |
16 V
|
15 V
|
Output Voltage1-Min |
1.24 V
|
1.8 V
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
HVSON
|
Package Equivalence Code |
SOP8,.25
|
SOLCC8,.12,20
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
240
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Regulator Type |
ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR
|
ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR
|
Seated Height-Max |
1.73 mm
|
0.9 mm
|
Surface Mount |
YES
|
YES
|
Technology |
BIPOLAR
|
|
Terminal Finish |
Tin/Lead (Sn85Pb15)
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
1.27 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
Width |
3.94 mm
|
3 mm
|
Base Number Matches |
2
|
2
|
Factory Lead Time |
|
7 Weeks
|
Packing Method |
|
TR
|
|
|
|
Compare MIC5209BM with alternatives
Compare MIC5209YML-TR with alternatives