MIC2076-1BN
vs
BD82065FVJ-E2
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
ROHM CO LTD
Part Package Code
DIP
SOIC
Package Description
DIP-8
TSSOP-8
Pin Count
8
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Built-in Protections
TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE
OVER CURRENT; THERMAL; UNDER VOLTAGE
Interface IC Type
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 Code
R-PDIP-T8
S-PDSO-G8
Length
9.525 mm
3 mm
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Current Flow Direction
SINK
SINK
Output Peak Current Limit-Nom
1.25 A
1.5 A
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
TSSOP
Package Equivalence Code
DIP8,.3
TSSOP8,.19
Package Shape
RECTANGULAR
SQUARE
Package Style
IN-LINE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
2.7 V
2.7 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
YES
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
0.65 mm
Terminal Position
DUAL
DUAL
Turn-off Time
5000 µs
40 µs
Turn-on Time
100 µs
20000 µs
Width
7.62 mm
3 mm
Base Number Matches
2
1
Pbfree Code
Rohs Code
Factory Lead Time
13 Weeks
Samacsys Manufacturer
ROHM Semiconductor
Driver Number of Bits
1
Output Current-Max
1 A
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Seated Height-Max
1.1 mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare MIC2076-1BN with alternatives
Compare BD82065FVJ-E2 with alternatives