MH89790BN1
vs
PEB2035PV4.1
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
ZARLINK SEMICONDUCTOR INC
|
SIEMENS A G
|
Part Package Code |
DIP
|
DIP
|
Package Description |
DIP,
|
,
|
Pin Count |
40
|
40
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
R-PDIP-T40
|
R-PDIP-T40
|
JESD-609 Code |
e3
|
|
Length |
50.8 mm
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
40
|
40
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Current-Max |
45 mA
|
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Telecom IC Type |
FRAMER
|
FRAMER
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
|
Terminal Position |
DUAL
|
DUAL
|
Width |
20.32 mm
|
|
Base Number Matches |
2
|
1
|
Technology |
|
CMOS
|
|
|
|
Compare MH89790BN1 with alternatives
Compare PEB2035PV4.1 with alternatives