MH89790BN
vs
PEB2035-P
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MITEL SEMICONDUCTOR
SIEMENS A G
Part Package Code
DIP
DIP
Package Description
DIP, DIP40,.8
,
Pin Count
40
40
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PDIP-T40
R-PDIP-T40
JESD-609 Code
e0
Number of Functions
1
1
Number of Terminals
40
40
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP40,.8
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Supply Current-Max
45 mA
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
HYBRID
CMOS
Telecom IC Type
FRAMER
FRAMER
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
2
2
Compare MH89790BN with alternatives
Compare PEB2035-P with alternatives