MH89790BN
vs
MH89790B
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MITEL SEMICONDUCTOR
ZARLINK SEMICONDUCTOR INC
Part Package Code
DIP
Package Description
DIP, DIP40,.8
DIP, DIP40,1.3
Pin Count
40
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PDIP-T40
R-PDIP-T40
JESD-609 Code
e0
e0
Number of Functions
1
1
Number of Terminals
40
40
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP40,.8
DIP40,1.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Supply Current-Max
45 mA
45 mA
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
HYBRID
HYBRID
Telecom IC Type
FRAMER
FRAMER
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
2
2
Length
50.8 mm
Width
33 mm
Compare MH89790BN with alternatives
Compare MH89790B with alternatives