MH32V725BST-5 vs M374F3200BJ1-C50 feature comparison

MH32V725BST-5 Mitsubishi Electric

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M374F3200BJ1-C50 Samsung Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MITSUBISHI ELECTRIC CORP SAMSUNG SEMICONDUCTOR INC
Part Package Code DIMM DIMM
Package Description DIMM, DIMM168 DIMM-168
Pin Count 168 168
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.36 8542.32.00.36
Access Mode FAST PAGE WITH EDO FAST PAGE WITH EDO
Access Time-Max 50 ns 50 ns
Additional Feature RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O Type COMMON COMMON
JESD-30 Code R-XDMA-N168 R-XDMA-N168
Memory Density 2415919104 bit 2415919104 bit
Memory IC Type EDO DRAM MODULE EDO DRAM MODULE
Memory Width 72 72
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 168 168
Number of Words 33554432 words 33554432 words
Number of Words Code 32000000 32000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 32MX72 32MX72
Output Characteristics 3-STATE 3-STATE
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIMM DIMM
Package Equivalence Code DIMM168 DIMM168
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Qualification Status Not Qualified Not Qualified
Refresh Cycles 8192 4096
Seated Height-Max 38.1 mm 41.275 mm
Standby Current-Max 0.025 A 0.018 A
Supply Current-Max 4.687 mA 1.944 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form NO LEAD NO LEAD
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 1 1

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Compare M374F3200BJ1-C50 with alternatives