M374F3200BJ1-C50
vs
KMM372F3200BK4-5
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
SAMSUNG SEMICONDUCTOR INC
Part Package Code
DIMM
Package Description
DIMM-168
DIMM, DIMM168
Pin Count
168
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.36
8542.32.00.36
Access Mode
FAST PAGE WITH EDO
FAST PAGE WITH EDO
Access Time-Max
50 ns
50 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-XDMA-N168
R-XDMA-N168
Memory Density
2415919104 bit
2415919104 bit
Memory IC Type
EDO DRAM MODULE
EDO DRAM MODULE
Memory Width
72
72
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
168
168
Number of Words
33554432 words
33554432 words
Number of Words Code
32000000
32000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
32MX72
32MX72
Output Characteristics
3-STATE
3-STATE
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIMM
DIMM
Package Equivalence Code
DIMM168
DIMM168
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
4096
4096
Seated Height-Max
41.275 mm
50.8 mm
Standby Current-Max
0.018 A
0.03 A
Supply Current-Max
1.944 mA
2.26 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Additional Feature
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
Compare M374F3200BJ1-C50 with alternatives
Compare KMM372F3200BK4-5 with alternatives