MG100H2YS1 vs BSM75GB60DLC feature comparison

MG100H2YS1 Toshiba America Electronic Components

Buy Now Datasheet

BSM75GB60DLC Infineon Technologies AG

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP INFINEON TECHNOLOGIES AG
Package Description FLANGE MOUNT, R-PUFM-X7 FLANGE MOUNT, R-XUFM-X7
Pin Count 7 7
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
Additional Feature HIGH SPEED
Case Connection ISOLATED ISOLATED
Collector Current-Max (IC) 100 A 100 A
Collector-Emitter Voltage-Max 500 V 600 V
Configuration SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE SERIES, 2 ELEMENTS WITH BUILT-IN DIODE
JESD-30 Code R-PUFM-X7 R-XUFM-X7
Number of Elements 2 2
Number of Terminals 7 7
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Shape RECTANGULAR RECTANGULAR
Package Style FLANGE MOUNT FLANGE MOUNT
Polarity/Channel Type N-CHANNEL N-CHANNEL
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Terminal Form UNSPECIFIED UNSPECIFIED
Terminal Position UPPER UPPER
Transistor Application MOTOR CONTROL
Transistor Element Material SILICON SILICON
Turn-off Time-Nom (toff) 800 ns 205 ns
Turn-on Time-Nom (ton) 800 ns 90 ns
Base Number Matches 1 2
Pbfree Code No
Rohs Code Yes
Part Package Code MODULE
Samacsys Manufacturer Infineon
Gate-Emitter Voltage-Max 20 V
Operating Temperature-Max 150 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Dissipation-Max (Abs) 355 W
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
VCEsat-Max 2.45 V

Compare MG100H2YS1 with alternatives

Compare BSM75GB60DLC with alternatives