MFM8126SM-70E vs GLS29EE010-70-4C-WHE feature comparison

MFM8126SM-70E Mosaic Semiconductor Inc

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GLS29EE010-70-4C-WHE Greenliant Systems Ltd

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOSAIC SEMICONDUCTOR INC GREENLIANT SYSTEMS LTD
Part Package Code DIP TSOP1
Package Description 0.600 INCH, CERAMIC, DIP-32 TSOP1,
Pin Count 32 32
Reach Compliance Code unknown compliant
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 70 ns 70 ns
JESD-30 Code R-CDIP-T32 R-PDSO-G32
Memory Density 1048576 bit 1048576 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 128KX8 128KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 5 V 5 V
Qualification Status Not Qualified
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL DUAL
Type NOR TYPE
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Length 12.4 mm
Package Code TSOP1
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Terminal Pitch 0.5 mm
Time@Peak Reflow Temperature-Max (s) 10
Width 8 mm
Write Cycle Time-Max (tWC) 10 ms

Compare MFM8126SM-70E with alternatives

Compare GLS29EE010-70-4C-WHE with alternatives