MDM11000TI-10 vs M5M41000AP-10 feature comparison

MDM11000TI-10 Mosaic Semiconductor Inc

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M5M41000AP-10 Mitsubishi Electric

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOSAIC SEMICONDUCTOR INC MITSUBISHI ELECTRIC CORP
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.02 8542.32.00.02
Access Mode FAST PAGE FAST PAGE
Access Time-Max 100 ns 100 ns
Additional Feature RAS/CBR/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
JESD-30 Code R-CDIP-T18 R-PDIP-T18
Memory Density 1048576 bit 1048576 bit
Memory IC Type FAST PAGE DRAM FAST PAGE DRAM
Memory Width 1 1
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 18 18
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 1MX1 1MX1
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Refresh Cycles 512 512
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
Part Package Code DIP
Package Description DIP, DIP18,.3
Pin Count 18
I/O Type SEPARATE
JESD-609 Code e0
Output Characteristics 3-STATE
Package Code DIP
Package Equivalence Code DIP18,.3
Seated Height-Max 4.7 mm
Standby Current-Max 0.0005 A
Supply Current-Max 0.06 mA
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 7.62 mm

Compare MDM11000TI-10 with alternatives

Compare M5M41000AP-10 with alternatives