M5M41000AP-10 vs MDM11000TM-10 feature comparison

M5M41000AP-10 Mitsubishi Electric

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MDM11000TM-10 Mosaic Semiconductor Inc

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MITSUBISHI ELECTRIC CORP MOSAIC SEMICONDUCTOR INC
Part Package Code DIP
Package Description DIP, DIP18,.3 ,
Pin Count 18
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.02 8542.32.00.02
Access Mode FAST PAGE FAST PAGE
Access Time-Max 100 ns 100 ns
Additional Feature RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS/CBR/HIDDEN REFRESH
I/O Type SEPARATE
JESD-30 Code R-PDIP-T18 R-CDIP-T18
JESD-609 Code e0
Memory Density 1048576 bit 1048576 bit
Memory IC Type FAST PAGE DRAM FAST PAGE DRAM
Memory Width 1 1
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 18 18
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 1MX1 1MX1
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Equivalence Code DIP18,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Refresh Cycles 512 512
Seated Height-Max 4.7 mm
Standby Current-Max 0.0005 A
Supply Current-Max 0.06 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 1 2

Compare M5M41000AP-10 with alternatives

Compare MDM11000TM-10 with alternatives