MD-003M vs IBM21S850 feature comparison

MD-003M Halo Electronics Inc

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IBM21S850 IBM

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Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer HALO ELECTRONICS INC IBM MICROELECTRONICS
Part Package Code DMA QFP
Package Description , LFQFP,
Pin Count 14 80
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-XDMA-T14 S-PQFP-G80
Length 27.432 mm 12 mm
Number of Functions 1 1
Number of Terminals 14 80
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Shape RECTANGULAR SQUARE
Package Style MICROELECTRONIC ASSEMBLY FLATPACK, LOW PROFILE, FINE PITCH
Seated Height-Max 8.89 mm 1.7 mm
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount NO YES
Telecom IC Type ETHERNET TRANSCEIVER ETHERNET TRANSCEIVER
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL QUAD
Width 25.4 mm 12 mm
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
JESD-609 Code e0
Package Code LFQFP
Qualification Status Not Qualified
Terminal Finish TIN LEAD
Terminal Pitch 0.5 mm

Compare MD-003M with alternatives

Compare IBM21S850 with alternatives