MD-003M
vs
IBM21S850
feature comparison
Part Life Cycle Code |
Obsolete
|
Contact Manufacturer
|
Ihs Manufacturer |
HALO ELECTRONICS INC
|
IBM MICROELECTRONICS
|
Part Package Code |
DMA
|
QFP
|
Package Description |
,
|
LFQFP,
|
Pin Count |
14
|
80
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
R-XDMA-T14
|
S-PQFP-G80
|
Length |
27.432 mm
|
12 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
14
|
80
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
MICROELECTRONIC ASSEMBLY
|
FLATPACK, LOW PROFILE, FINE PITCH
|
Seated Height-Max |
8.89 mm
|
1.7 mm
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
NO
|
YES
|
Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Form |
THROUGH-HOLE
|
GULL WING
|
Terminal Position |
DUAL
|
QUAD
|
Width |
25.4 mm
|
12 mm
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
No
|
Rohs Code |
|
No
|
JESD-609 Code |
|
e0
|
Package Code |
|
LFQFP
|
Qualification Status |
|
Not Qualified
|
Terminal Finish |
|
TIN LEAD
|
Terminal Pitch |
|
0.5 mm
|
|
|
|
Compare MD-003M with alternatives
Compare IBM21S850 with alternatives