IBM21S850
vs
VSC7135QN
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Contact Manufacturer
Obsolete
Ihs Manufacturer
IBM MICROELECTRONICS
VITESSE SEMICONDUCTOR CORP
Part Package Code
QFP
QFP
Package Description
LFQFP,
QFP, QFP64,.66SQ,32
Pin Count
80
64
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PQFP-G80
S-PQFP-G64
JESD-609 Code
e0
e0
Length
12 mm
14 mm
Number of Functions
1
1
Number of Terminals
80
64
Operating Temperature-Max
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
QFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
FLATPACK
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.7 mm
2.35 mm
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Telecom IC Type
ETHERNET TRANSCEIVER
ETHERNET TRANSCEIVER
Temperature Grade
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.8 mm
Terminal Position
QUAD
QUAD
Width
12 mm
14 mm
Base Number Matches
1
1
Data Rate
1250000 Mbps
Number of Transceivers
1
Package Equivalence Code
QFP64,.66SQ,32
Supply Current-Max
0.29 mA
Technology
GAAS
Compare IBM21S850 with alternatives
Compare VSC7135QN with alternatives