MCR50JRTF1051 vs 2010W2F1051B3E feature comparison

MCR50JRTF1051 ROHM Semiconductor

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2010W2F1051B3E Royal Electronic Factory (Thailand) Co Ltd

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ROHM CO LTD ROYAL ELECTRONIC FTY CO LTD
Package Description CHIP
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30
Construction Chip Chip
Mounting Feature SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.55 mm
Package Length 5 mm 5 mm
Package Shape RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 2.5 mm 2.5 mm
Packing Method TR, EMBOSSED, 7 INCH
Rated Power Dissipation (P) 0.5 W 0.5 W
Rated Temperature 70 °C
Reference Standard TS 16949
Resistance 1050 Ω 1050 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 2010 2010
Surface Mount YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Shape WRAPAROUND
Tolerance 1% 1%
Working Voltage 200 V 200 V
Base Number Matches 1 1
Series 2010(1/2W,F TOL)

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Compare 2010W2F1051B3E with alternatives