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MCR50JRTF1051 vs 2010W2F1051TDE feature comparison

MCR50JRTF1051 ROHM Semiconductor

Buy Now Datasheet

2010W2F1051TDE Royal Electronic Factory (Thailand) Co Ltd

Buy Now Datasheet
Part Life Cycle Code Obsolete Active
Ihs Manufacturer ROHM CO LTD ROYAL ELECTRONIC FTY CO LTD
Package Description CHIP
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30
Construction Chip Chip
Mounting Feature SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.55 mm
Package Length 5 mm 5 mm
Package Shape RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 2.5 mm 2.5 mm
Packing Method TR, EMBOSSED, 7 INCH
Rated Power Dissipation (P) 0.5 W 0.5 W
Rated Temperature 70 °C
Reference Standard TS 16949
Resistance 1050 Ω 1050 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 2010 2010
Surface Mount YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Shape WRAPAROUND
Tolerance 1% 1%
Working Voltage 200 V 200 V
Base Number Matches 1 1
Resistors » Metal Glaze/Thick Film Resistors
Resistors » Metal Glaze/Thick Film Resistors

Compare MCR50JRTF1051 with alternatives

Compare 2010W2F1051TDE with alternatives