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MCR03EZPFX12R1 vs TSR3GTF12R1V feature comparison

MCR03EZPFX12R1 ROHM Semiconductor

Buy Now Datasheet

TSR3GTF12R1V Tateyama Kagaku Group

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer ROHM CO LTD TATEYAMA KAGAKU GROUP
Package Description CHIP
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30
Construction Rectangular Chip
JESD-609 Code e3
Mounting Feature SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.45 mm 0.45 mm
Package Length 1.6 mm 1.6 mm
Package Shape RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 0.8 mm 0.8 mm
Packing Method TR, Paper, 7 Inch Tape
Rated Power Dissipation (P) 0.1 W 0.1 W
Rated Temperature 70 °C
Resistance 12.1 Ω 12.1 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0603 0603
Surface Mount YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish TIN OVER NICKEL
Terminal Shape WRAPAROUND
Tolerance 1% 1%
Working Voltage 50 V 50 V
Base Number Matches 1 1
Resistors » Metal Glaze/Thick Film Resistors
Resistors » Metal Glaze/Thick Film Resistors

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