MCP98243-BE/MNY
vs
SE98TK
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
NXP SEMICONDUCTORS
|
| Package Description |
2 X 3 MM, 0.75 HEIGHT, PLASTIC, TDFN-8
|
SOLCC8,.11,20
|
| Reach Compliance Code |
compliant
|
unknown
|
| Accuracy-Max (Cel) |
2 Cel
|
4 Cel
|
| Body Breadth |
3 mm
|
3 mm
|
| Body Height |
0.75 mm
|
1 mm
|
| Body Length or Diameter |
2 mm
|
3 mm
|
| Housing |
PLASTIC
|
PLASTIC
|
| JESD-609 Code |
e4
|
|
| Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
| Number of Bits |
11
|
16
|
| Operating Current-Max |
0.5 mA
|
0.25 mA
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-20 °C
|
| Output Interface Type |
2-WIRE INTERFACE
|
2-WIRE INTERFACE
|
| Package Shape/Style |
RECTANGULAR
|
SQUARE
|
| Sensors/Transducers Type |
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
|
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
| Termination Type |
SOLDER
|
SOLDER
|
| Base Number Matches |
1
|
2
|
| Number of Terminals |
|
8
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Equivalence Code |
|
SOLCC8,.11,20
|
|
|
|
Compare MCP98243-BE/MNY with alternatives
Compare SE98TK with alternatives