MCP98242-BE/MCBAC
vs
TSE2002GB2A1NCG8
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Package Description |
3 X 2 MM, 0.90 MM HEIGHT, PLASTIC, DFN-8
|
TDFN-4
|
| Reach Compliance Code |
unknown
|
compliant
|
| Accuracy-Max (Cel) |
2 Cel
|
1 Cel
|
| Body Breadth |
2 mm
|
|
| Body Height |
0.9 mm
|
|
| Body Length or Diameter |
3 mm
|
|
| Housing |
PLASTIC
|
|
| Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
| Number of Bits |
16
|
|
| Operating Current-Max |
0.5 mA
|
0.7 mA
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-20 °C
|
| Output Interface Type |
2-WIRE INTERFACE
|
2-WIRE INTERFACE
|
| Package Shape/Style |
RECTANGULAR
|
RECTANGULAR
|
| Sensors/Transducers Type |
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
|
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
2.3 V
|
| Surface Mount |
YES
|
YES
|
| Termination Type |
SOLDER
|
SOLDER
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
DFN
|
| Pin Count |
|
8
|
| Manufacturer Package Code |
|
NCG8P1
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.32.00.51
|
| JESD-609 Code |
|
e3
|
| Number of Terminals |
|
8
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Equivalence Code |
|
SOLCC8,.12,20
|
| Terminal Finish |
|
Matte Tin (Sn)
|
|
|
|
Compare MCP98242-BE/MCBAC with alternatives
Compare TSE2002GB2A1NCG8 with alternatives