MCP8025T-115E/MP
vs
MCP8025T-115E/PT
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Not Recommended
|
Not Recommended
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
QFN-40
|
TQFP-48
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
23 Weeks
|
24 Weeks
|
| Samacsys Manufacturer |
Microchip
|
Microchip
|
| Analog IC - Other Type |
BRUSHLESS DC MOTOR CONTROLLER
|
BRUSHLESS DC MOTOR CONTROLLER
|
| JESD-30 Code |
S-PQCC-N40
|
S-PQFP-G48
|
| JESD-609 Code |
e3
|
e3
|
| Length |
5 mm
|
7 mm
|
| Moisture Sensitivity Level |
1
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
40
|
48
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HTFQFP
|
| Package Equivalence Code |
LCC40,.2SQ,16
|
QFP48,.35SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
|
| Screening Level |
AEC-Q100;TS 16949
|
AEC-Q100;TS 16949
|
| Seated Height-Max |
0.9 mm
|
1.2 mm
|
| Supply Current-Max (Isup) |
0.3 mA
|
0.3 mA
|
| Supply Voltage-Max (Vsup) |
19 V
|
19 V
|
| Supply Voltage-Min (Vsup) |
6 V
|
6 V
|
| Supply Voltage-Nom (Vsup) |
13 V
|
13 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.4 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
5 mm
|
7 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare MCP8025T-115E/MP with alternatives
Compare MCP8025T-115E/PT with alternatives