MCP6V03T-E/MNY
vs
MCP6033-E/SL
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
DFN
SOIC
Package Description
HVSON, SOLCC8,.11,20
SOP,
Pin Count
8
14
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Factory Lead Time
4 Weeks
Samacsys Manufacturer
Microchip
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
0.005 µA
0.0001 µA
Common-mode Reject Ratio-Nom
152 dB
93 dB
Frequency Compensation
YES
Input Offset Voltage-Max
2 µV
150 µV
JESD-30 Code
R-PDSO-N8
R-PDSO-G14
JESD-609 Code
e4
e3
Length
3 mm
8.65 mm
Low-Bias
YES
Low-Offset
YES
Micropower
YES
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
8
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVSON
SOP
Package Equivalence Code
SOLCC8,.08,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Packing Method
TAPE AND REEL
Peak Reflow Temperature (Cel)
260
Power
NO
Programmable Power
NO
Qualification Status
Not Qualified
Not Qualified
Screening Level
TS 16949
Seated Height-Max
0.8 mm
1.75 mm
Slew Rate-Nom
0.5 V/us
4000 V/us
Supply Current-Max
0.4 mA
Supply Voltage Limit-Max
6.5 V
7 V
Supply Voltage-Nom (Vsup)
5.5 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
NICKEL PALLADIUM GOLD
MATTE TIN
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.5 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
Unity Gain BW-Nom
1300
10
Voltage Gain-Min
3162000
Wideband
NO
Width
2 mm
3.9 mm
Base Number Matches
1
1
Compare MCP6V03T-E/MNY with alternatives
Compare MCP6033-E/SL with alternatives