MCP662/T-E/MF
vs
MCP662/T-E/SN
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
DFN
SOIC
Package Description
HVSON,
SOP,
Pin Count
8
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
0.005 µA
0.005 µA
Common-mode Reject Ratio-Min
66 dB
66 dB
Common-mode Reject Ratio-Nom
81 dB
81 dB
Frequency Compensation
YES
YES
Input Offset Voltage-Max
8000 µV
8000 µV
JESD-30 Code
S-PDSO-N8
R-PDSO-G8
JESD-609 Code
e3
e3
Length
3 mm
4.9 mm
Low-Bias
YES
YES
Low-Offset
NO
NO
Micropower
NO
NO
Moisture Sensitivity Level
1
Number of Functions
2
2
Number of Terminals
8
8
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVSON
SOP
Package Equivalence Code
SOLCC8,.12,25
SOP8,.25
Package Shape
SQUARE
RECTANGULAR
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE
Packing Method
TR
TR
Peak Reflow Temperature (Cel)
260
Power
NO
NO
Programmable Power
NO
NO
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
1.75 mm
Slew Rate-Nom
32 V/us
32 V/us
Supply Current-Max
18 mA
18 mA
Supply Voltage Limit-Max
6.5 V
6.5 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
Unity Gain BW-Nom
60000
60000
Voltage Gain-Min
25100
25100
Wideband
NO
NO
Width
3 mm
3.9 mm
Base Number Matches
1
1
Compare MCP662/T-E/MF with alternatives
Compare MCP662/T-E/SN with alternatives