Part Details for MCP662/T-E/MF by Microchip Technology Inc
Overview of MCP662/T-E/MF by Microchip Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (2 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Audio and Video Systems
Smart Cities
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Medical Imaging
Part Details for MCP662/T-E/MF
MCP662/T-E/MF CAD Models
MCP662/T-E/MF Part Data Attributes
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MCP662/T-E/MF
Microchip Technology Inc
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Datasheet
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MCP662/T-E/MF
Microchip Technology Inc
DUAL OP-AMP, 8000 uV OFFSET-MAX, 60 MHz BAND WIDTH, PDSO8, 3 X 3 MM, 0.90 MM HEIGHT, PLASTIC, DFN-8
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Part Package Code | DFN | |
| Package Description | HVSON, | |
| Pin Count | 8 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.33.00.01 | |
| Amplifier Type | OPERATIONAL AMPLIFIER | |
| Architecture | VOLTAGE-FEEDBACK | |
| Average Bias Current-Max (IIB) | 0.005 µA | |
| Common-mode Reject Ratio-Min | 66 dB | |
| Common-mode Reject Ratio-Nom | 81 dB | |
| Frequency Compensation | YES | |
| Input Offset Voltage-Max | 8000 µV | |
| JESD-30 Code | S-PDSO-N8 | |
| JESD-609 Code | e3 | |
| Length | 3 mm | |
| Low-Bias | YES | |
| Low-Offset | NO | |
| Micropower | NO | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 2 | |
| Number of Terminals | 8 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HVSON | |
| Package Equivalence Code | SOLCC8,.12,25 | |
| Package Shape | SQUARE | |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Packing Method | TR | |
| Peak Reflow Temperature (Cel) | 260 | |
| Power | NO | |
| Programmable Power | NO | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1 mm | |
| Slew Rate-Nom | 32 V/us | |
| Supply Current-Max | 18 mA | |
| Supply Voltage Limit-Max | 6.5 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Unity Gain BW-Nom | 60000 | |
| Voltage Gain-Min | 25100 | |
| Wideband | NO | |
| Width | 3 mm |
Alternate Parts for MCP662/T-E/MF
This table gives cross-reference parts and alternative options found for MCP662/T-E/MF. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MCP662/T-E/MF, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MCP662T-E/MF | DUAL OP-AMP, 8000 uV OFFSET-MAX, 60 MHz BAND WIDTH, PDSO8, 3 X 3 MM, 0.90 MM HEIGHT, PLASTIC, DFN-8 | Microchip Technology Inc | MCP662/T-E/MF vs MCP662T-E/MF |
| MCP662-E/MF | DUAL OP-AMP, 8000 uV OFFSET-MAX, 60 MHz BAND WIDTH, PDSO8, 3 X 3 MM, 0.90 MM HEIGHT, PLASTIC, DFN-8 | Microchip Technology Inc | MCP662/T-E/MF vs MCP662-E/MF |